Multi-layered ceramic electronic component

ABSTRACT

A multi-layered ceramic electronic component includes a ceramic body including a dielectric layer, and a plurality of first and second internal electrodes opposing each other with the dielectric layer interposed therebetween; and first and second external electrodes arranged outside of the ceramic body and electrically connected to the first and second internal electrodes, wherein the dielectric layer comprises a dielectric ceramic composition containing: a base material represented by (Ba 1-x Ca x )TiO 3  (0&lt;x≤0.09) as a main component, Y as a first accessory component, Mg as a second accessory component, Ba or Zr, or a mixture thereof, as a third accessory component, Mn, Ni, W, V, or Fe, or mixtures thereof, as a fourth accessory component, and Si as a fifth accessory component.

CROSS-REFERENCE TO RELATED APPLICATION

This application is the continuation application of U.S. patentapplication Ser. No. 16/353,489 filed on Mar. 14, 2019, which claimsbenefit of priority to Korean Patent Application No. 10-2018-0160025filed on Dec. 12, 2018 in the Korean Intellectual Property Office, thedisclosures of which are incorporated herein by reference in theirentirety.

1. TECHNICAL FIELD

The present disclosure relates to a multi-layered ceramic electroniccomponent, and more particularly, to a high-capacity multi-layeredceramic electronic component having excellent reliability.

2. BACKGROUND

In recent years, miniaturization, slimming and multifunctionalization ofelectronic products have demanded miniaturization of multi-layeredceramic capacitors, and mounting of multi-layered ceramic capacitors isalso highly integrated.

A multi-layered ceramic capacitor, one of electronic components, may bemounted on the printed circuit boards of various electronic products,for example, an imaging device such as a liquid crystal display (LCD)and a plasma display panel (PDP), a computer, a personal digitalassistant (PDA), mobile phones, and the like, and may serve to charge ordischarge electricity.

Such multi-layered ceramic capacitors may be used as components ofvarious electronic devices, due to relatively compact size, relativelyhigh capacity, relative ease of mounting, and the like.

In the meantime, as interest in industry for electric/electroniccomponents has increased recently, multi-layered ceramic capacitors havealso been required to have high reliability and high capacity in orderto be used in vehicles or infotainment systems.

In particular, as electronic control systems for internal combustionvehicles and electric vehicles are increasing, there is a growing demandfor multi-layered ceramic capacitors that may be used in relatively hightemperature environments.

PRIOR ART DOCUMENT

(Patent Document 1) Japanese Patent Publication No. 2011-018874

SUMMARY

An aspect of the present disclosure is to provide a multi-layeredceramic electronic component, and more particularly, to a high-capacitymulti-layered ceramic electronic component having excellent reliability.

According to an aspect of the present disclosure, a multi-layeredceramic electronic component includes a ceramic body including adielectric layer, and a plurality of first and second internalelectrodes opposing each other with the dielectric layer interposedtherebetween, and including first and second surfaces opposing eachother in a first direction, third and fourth surfaces connected to thefirst and second surfaces and opposing each other in a second direction,and fifth and sixth surfaces connected to the first to fourth surfacesand opposing each other in a third direction; and first and secondexternal electrodes arranged outside of the ceramic body andelectrically connected to the first and second internal electrodes,wherein the dielectric layer comprises a dielectric ceramic compositioncontaining: a base material represented by (Ba_(1-x)Ca_(x))TiO₃(0<x≤0.09) as a main component; yttrium (Y) as a first accessorycomponent; magnesium (Mg) as a second accessory component; barium (Ba)or zirconium (Zr), or a mixture thereof, as a third accessory component;manganese (Mn), nickel (Ni), tungsten (W), vanadium (V), or iron (Fe),or mixtures thereof, as a fourth accessory component; and silicon (Si)as a fifth accessory component.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription, taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a perspective view illustrating a multi-layered ceramiccapacitor according to an embodiment of the present disclosure;

FIG. 2 is a schematic view illustrating a ceramic body according to anembodiment of the present disclosure;

FIG. 3 is a cross-sectional view taken along line I-I′ in FIG. 1according to an embodiment of the present disclosure;

FIG. 4 is an enlarged view of B portion in FIG. 3; and

FIG. 5 is a cross-sectional view taken along line I-I′ in FIG. 1according to another embodiment of the present disclosure.

DETAILED DESCRIPTION

The embodiments of the present disclosure may be modified into variousother forms, and the scope of the present disclosure is not limited tothe embodiments described below. Embodiments of the present disclosuremay be also provided to more fully describe the present disclosure tothose skilled in the art. Therefore, the shapes and sizes of theelements in the drawings may be exaggerated for clarity, and theelements denoted by the same reference numerals in the drawings are thesame elements.

Throughout the specification, when an element is referred to as“comprising”, it means that it may include other elements as well,rather than excluding other elements unless specifically statedotherwise.

In order to clearly illustrate the present disclosure, parts not relatedto the description are omitted, and thicknesses are enlarged in order toclearly represent layers and regions, and similar portions are denotedby similar reference numerals throughout the specification.

Hereinafter, preferred embodiments of the present disclosure will bedescribed with reference to the accompanying drawings.

FIG. 1 is a perspective view illustrating a multi-layered ceramiccapacitor according to an embodiment of the present disclosure.

FIG. 2 is a schematic view illustrating a ceramic body according to anembodiment of the present disclosure.

FIG. 3 is a cross-sectional view taken along line I-I′ in FIG. 1according to an embodiment of the present disclosure.

FIG. 4 is an enlarged view of B portion in FIG. 3.

Referring to FIGS. 1 to 4, a multi-layered ceramic electronic component100 according to an embodiment of the present disclosure may include aceramic body 110 including a dielectric layer 111, and a plurality offirst and second internal electrodes 121 and 122 opposing each otherwith the dielectric layer 111 interposed therebetween, including firstand second surfaces S1 and S2 opposing each other in a first direction,third and fourth surfaces S3 and S4 connected to the first and secondsurfaces S1 and S2 and opposing each other in a second direction, andfifth and sixth surfaces S5 and S6 connected to the first to fourthsurfaces S1 to S4 and opposing each other in a third direction; andfirst and second external electrodes 131 and 132 arranged outside of theceramic body 110 and electrically connected to the first and secondinternal electrodes 121 and 122.

Hereinafter, a multi-layered ceramic electronic component according toan embodiment of the present disclosure will be described, but amulti-layered ceramic capacitor may be specifically described, but thepresent disclosure is not limited thereto.

In a multi-layered ceramic capacitor according to an embodiment of thepresent disclosure, a ‘length direction’ of the multi-layered ceramiccapacitor refers to an ‘L’ direction of FIG. 1, a ‘width direction’ ofthe multi-layered ceramic capacitor refers to a ‘W’ direction of FIG. 1,and a ‘thickness direction’ of the multi-layered ceramic capacitorrefers to a ‘I’ direction of FIG. 1. The ‘thickness direction’ may beused in the same sense as the direction in which the dielectric layersare stacked up, e.g., as a ‘layering direction.’

In an embodiment of the present disclosure, a shape of the ceramic body110 is not particularly limited in shape, but may be a hexahedral shape,as illustrated.

The ceramic body 110 may include first and second surfaces S1 and S2opposing each other in a first direction, third and fourth surfaces S3and S4 connected to the first and second surfaces S1 and S2 and opposingeach other in a second direction, and fifth and sixth surfaces S5 and S6connected to the first to fourth surfaces S1 to S4 and opposing eachother in a third direction.

The first surface S1 and the second surface S2 may be defined to faceeach other in a thickness direction of the ceramic body 110, i.e., in afirst direction, the third surface S3 and the fourth surface S4 may bedefined to face each other in a length direction of the ceramic body110, i.e., in a second direction, and the fifth surface S5 and the sixthsurface S6 may be defined to face each other in a width direction of theceramic body 110, i.e., in a third direction.

One ends of the plurality of first and second internal electrodes 121and 122 formed in the ceramic body 110 may be exposed to the thirdsurface S3 or the fourth surface S4 of the ceramic body.

The internal electrodes 121 and 122 may have a first internal electrode121 and a second internal electrode 122, having different polarities, inpairs.

One end of the first internal electrode 121 may be exposed to the thirdsurface S3, and one end of the second internal electrode 122 may beexposed to the fourth surface S4.

The other ends of the first internal electrode 121 and the secondinternal electrode 122 may be formed at regular intervals from thefourth surface S4 or the third surface S3. More specific details thereofwill be described later.

The first and second external electrodes 131 and 132 may be formed onthe third surface S3 and the fourth surface S4 of the ceramic body, andmay be electrically connected to the internal electrodes.

The ceramic body 110 may include an active portion A serving as aportion contributing to capacity formation of the capacitor, and anupper cover portion C1 and a lower cover portion C2 formed respectivelyabove and below the active portion A as upper and lower margin portions.

The active portion A may be formed by repeatedly stacking a plurality offirst and second inner electrodes 121 and 122 with a dielectric layer111 interposed therebetween.

The upper cover portion C1 and the lower cover portion C2 may have thesame material and configuration as those of the dielectric layer 111,except that they do not include internal electrodes.

For example, the upper cover portion C1 and the lower cover portion C2may include a ceramic material, for example, a barium titanate(BaTiO₃)-based ceramic material.

The upper cover portion C1 and the lower cover portion C2 may be formedby stacking a single dielectric layer or two or more dielectric layerson upper and lower surfaces of the active portion A in the verticaldirection, and may basically serve to prevent the internal electrodefrom being damaged by physical or chemical stress.

The material forming the first and second internal electrodes 121 and122 is not particularly limited, and may be formed using a conductivepaste including silver (Ag), lead (Pb), platinum (Pt), nickel (Ni), orcopper (Cu), or mixtures thereof.

A multi-layered ceramic capacitor according to an embodiment of thepresent disclosure may include a first external electrode 131electrically connected to the first internal electrode 121 and a secondexternal electrode 132 electrically connected to the second internalelectrode 122.

The first and second external electrodes 131 and 132 may be electricallyconnected to the first and second internal electrodes 121 and 122 toform electrostatic capacity, and the second external electrode 132 maybe connected to a potential different from that of the first externalelectrode 131.

The first and second external electrodes 131 and 132 may be respectivelyarranged on the third surface S3 and the fourth surface S4 in the lengthdirection, i.e., in the second direction of the ceramic body 110, butmay extend into the first surface S1 and the second surface S2 in thethickness direction, i.e., in the first direction of the ceramic body110.

The external electrodes 131 and 132 may be arranged outside of theceramic body 111, and may include electrode layers 131 a and 132 aelectrically connected to the internal electrodes 121 and 122, andconductive resin layers 131 b and 132 b arranged on the electrode layers131 a and 132 a.

The electrode layers 131 a and 132 a may include a conductive metal anda glass.

The conductive metal used for the electrode layers 131 a and 132 a isnot particularly limited as long as it is a material that may beelectrically connected to the internal electrode for formation ofelectrostatic capacity. For example, the conductive metal may be one ormore selected from the group consisting of copper (Cu), silver (Ag),nickel (Ni), and alloys thereof.

The electrode layers 131 a and 132 a may be formed by applying aconductive paste prepared by adding glass frit to a powder of theconductive metal, and then firing the paste.

The conductive resin layers 131 b and 132 b may be formed on theelectrode layers 131 a and 132 a, and may be formed to completely coverthe electrode layers 131 a and 132 a.

Since the conductive resin layers 131 b and 132 b may be formed tocompletely cover the electrode layers 131 a and 132 a, a distancebetween both end portions of the conductive resin layers 131 b and 132 barranged on the first surface S1 and the second surface S2 of theceramic body 110 may be longer than a distance between both end portionsof the electrode layers 131 a and 132 a arranged on the first surface S1and the second surface S2 of the ceramic body 110.

A base resin included in the conductive resin layers 131 b and 132 b isnot particularly limited as long as it has bondability and impactabsorbing ability, and may be mixed with the conductive metal powder toform a paste. For example, the base resin may include an epoxy resin.

The conductive metal included in the conductive resin layers 131 b and132 b is not particularly limited as long as it is a material that maybe electrically connected to the electrode layers 131 a and 132 a. Forexample, the conductive metal may include one or more selected from thegroup consisting of copper (Cu), silver (Ag), nickel (Ni), and alloysthereof.

Plated layers 131 c, 132 c, 131 d, and 132 d may be further arranged onthe conductive resin layers 131 b and 132 b.

The plated layers 131 c, 132 c, 131 d, and 132 d may be arranged on theconductive resin layers 131 b and 132 b, and may formed to completelycover the conductive resin layers 131 b and 132 b.

The plated layers 131 c, 132 c, 131 d, and 132 d may include nickel (Ni)plated layers 131 c and 132 c arranged on the conductive resin layers131 b and 132 b, and platinum (Pd) plated layers 131 d and 132 darranged on the nickel (Ni) plated layers 131 c and 132 c.

According to an embodiment of the present disclosure, the dielectriclayer 111 may include a dielectric ceramic composition containing: abase material represented by (Ba_(1-x)Ca_(x))TiO₃ (0<x≤0.09) as a maincomponent; Y as a first accessory component; Mg as a second accessorycomponent; Ba or Zr, or a mixture thereof, as a third accessorycomponent; Mn, Ni, W, V, or Fe, or mixtures thereof, as a fourthaccessory component; and Si as a fifth accessory component.

As interest in industry for electric/electronic components has increasedrecently, multi-layered ceramic capacitors are also required to havehigh reliability and high capacity in order to be used in vehicles orinfotainment systems.

In particular, as electronic control systems for internal combustionvehicles and electric vehicles are increasing, there is growing demandfor multi-layered ceramic capacitors that may be used in relatively hightemperature environments.

At present, the dielectric material of the high-capacity multi-layeredceramic capacitor may mainly be barium titanate (BaTiO₃). Since thedielectric material should fire the ceramic body in a reducingatmosphere while using a nickel (Ni) internal electrode, the dielectricmaterial may have resistance to reduction.

However, due to the intrinsic properties of barium titanate (BaTiO₃)oxides, the electrostatic capacity may be greatly reduced in anenvironment of 150° C. or higher, such that it may be difficult tosecure electrical characteristics in accordance with the temperaturerequired by the electric/electronic device.

In addition, it is almost impossible to expand the temperature up to200° C., and it was necessary to develop a multi-layered ceramiccapacitor which may be used in a relatively high temperature environmentby applying a new composition thereto.

According to an embodiment of the present disclosure, a high-capacitymulti-layered ceramic capacitor stably securing the rate of change inhigh-temperature capacity may be realized, by way of controlling thecontent of each component in a dielectric layer containing: a basematerial represented by (Ba_(1-x)Ca_(x))TiO₃ (0<x≤0.09) as a maincomponent; Y as a first accessory component; Mg as a second accessorycomponent; Ba or Zr, or a mixture thereof, as a third accessorycomponent; Mn, Ni, W, V, or Fe, or mixtures thereof, as a fourthaccessory component; and Si as a fifth accessory component.

Specifically, according to an embodiment of the present disclosure, ahigh-capacity multi-layered ceramic capacitor stably securing the rateof change in high-temperature capacity may be realized, by way of havinga dielectric ceramic composition containing a base material representedby (Ba_(1-x)Ca_(x))TiO₃ (0<x≤0.09) as a main component and the Ca in anamount of 9 moles or less, based on 100 moles of Ti.

Hereinafter, each component of the dielectric ceramic compositionincluded in the dielectric layer according to an embodiment of thepresent disclosure will be described in more detail.

a) Base Material Powder

According to an embodiment of the present disclosure, the dielectriclayer 111 may include a base material represented by(Ba_(1-x)Ca_(x))TiO₃ (0<x≤0.09) as a main component.

The base material as a main component may be contained in the form ofpowder, and the calcium (Ca) may be contained in the dielectric layer111 in an amount of 9 moles or less, based on 100 moles of Ti.

The base material as a main component may be represented by(Ba_(1-x)Ca_(x))TiO₃ (“BCT”). The BCT material may be a material used asa base material for a general dielectric, and may be a ferroelectricmaterial.

A high-capacity multi-layered ceramic capacitor stably securing the rateof change in high-temperature capacity may be realized, by way of havingthe Ca in an amount of 9 moles or less, based on 100 moles of Ti, in(Ba_(1-x)Ca_(x))TiO₃, which is the base material as a main component.

When the Ca is contained in an amount greater than 9 moles, based on 100moles of Ti, it may be difficult to stably secure the rate of change inhigh-temperature capacity.

According to an embodiment of the present disclosure, the base materialmain component may further include BaTiO₃, BaTi₂O₅, or(Ba_(1-x)Ca_(x))Ti₂O₅ (0<x≤0.09), or mixtures thereof.

When the base material as a main component further contains BaTiO₃ inaddition to (Ba_(1-x)Ca_(x))TiO₃, the dielectric constant may increaseto realize a high-capacity multi-layered ceramic capacitor.

When the base material as a main component further contains BaTi₂O₅ or(Ba_(1-x)Ca_(x)) Ti₂O₅ (0<x≤0.09), or a mixture thereof in addition to(Ba_(1-x)Ca_(x)) TiO₃, the rate of change in high-temperature capacitymay be secured more stably.

In the case of BaTi₂O₅ and (Ba_(1-x)Ca_(x)) Ti₂O₅, the ferroelectrictransition temperature thereof may be higher than that of(Ba_(1-x)Ca_(x))TiO₃ which is the base material as a main componentaccording to an embodiment of the present disclosure.

Therefore, when BaTi₂O₅ and (Ba_(1-x)Ca_(x)) Ti₂O₅ are further includedin the base material as a main component, the rate of change inhigh-temperature capacity may be more stably secured due to a relativelyhigh ferroelectric transition temperature characteristics.

In the case of BaTi₂O₅ and (Ba_(1-x)Ca_(x)) Ti₂O₅, titanium (Ti) mayexist excessively in comparison with BaTiO₃ in the prior art. Therefore,there may be problems, for example, that titanium (Ti) may react withnickel (Ni) constituting the internal electrode, and nickel (Ni) maydiffuse into the dielectric layer.

As a result, there may be a problem that the dielectric constant of themulti-layered ceramic capacitor may be lowered.

Therefore, it is preferable that the content of BaTi₂O₅ and(Ba_(1-x)Ca_(x)) Ti₂O₅ is appropriately adjusted. In particular, it ispreferable that a total amount of BaTi₂O₅ and (Ba_(1-x)Ca_(x)) Ti₂O₅included in the dielectric ceramic composition is 30 mol % or less,based on 100 mol % of the entire base material as a main component.

Meanwhile, the dielectric layer 111 may include dielectric grains, andan average size of the dielectric grains may be 400 nm or less,preferably 200 nm or less, but is not limited thereto.

b) First Accessory Component

According to an embodiment of the present disclosure, the dielectricceramic composition may contain Y as a first accessory component, and Y,the first accessory component, may include more than 3 moles and lessthan 6 moles, based on 100 moles of Ti included in the dielectricceramic composition, in the form of oxide.

The first accessory component may serve to improve the DC-biascharacteristic of the multi-layered ceramic capacitor to which thedielectric ceramic composition is applied, and to improve reliability byincreasing a high-temperature withstand voltage.

When the content of the first accessory component is 3 moles or less,based on 100 moles of Ti, a crystal grain size of a dielectric grain mayincrease to 400 nm or more, a leakage current may increase, and a roomtemperature resistance may decrease.

When the content of the first accessory component is at least 6 moles,based on 100 moles of Ti, a secondary phase (Y₂Ti₂O₇) may be generatedand a dielectric breakdown due to the deterioration of the insulationresistance (IR) may increase at relatively high temperatures.

c) Second Accessory Component

According to an embodiment of the present disclosure, the dielectricceramic composition may contain Mg as a second accessory component.

Mg as a second accessory component may be contained in an amount of 1.5moles or more and 2.5 moles or less, based on 100 moles of Ti, in theform of oxide.

Mg as a second accessory component may be contained in an amount of 1.5moles or more and 2.5 moles or less, based on 100 moles of Ti, in theform of oxide, such that the grain size of the dielectric grain may becontrolled according to an embodiment of the present disclosure.

When the content of the second accessory component is less than 1.5moles, based on 100 moles of Ti, the rare earth metal oxide mayaccelerate formation of the crystal grains of the dielectric grains, toincrease the grain size and to deteriorate the dielectric constantcharacteristics in accordance with the temperature.

When the content of the second accessory component exceeds 2.5 moles,based on 100 moles of Ti, the rare earth oxide may not contribute toformation of crystal grains of the dielectric grains and may be presentin grain boundaries, to deteriorate high-temperature insulationresistance characteristics.

d) Third Accessory Component

According to an embodiment of the present disclosure, the dielectricceramic composition may contain Ba or Zr, or a mixture thereof, as athird accessory component.

The dielectric ceramic composition may contain Ba or Zr, or a mixturethereof, as a third accessory component in an amount of 1.5 moles ormore and 3.5 moles or less, based on 100 moles of Ti.

The third accessory component may contribute to the generation ofcrystal grains of dielectric grains, and may serve to control thedielectric constant.

The dielectric ceramic composition may contain Ba or Zr, or a mixturethereof, as a third accessory component in an amount of 1.5 moles ormore and 3.5 moles or less, based on 100 moles of Ti, to achieve targetcharacteristics such as the dielectric constant of the multi-layeredceramic capacitor, and the like.

When the content of the third accessory component is less than 1.5moles, based on 100 moles of Ti, target characteristics such as thedielectric constant of the multi-layered ceramic capacitor, and the likemay not be obtained.

When the content of the third accessory component is more than 3.5moles, based on 100 moles of Ti, the third accessory component may notcontribute to the formation of crystal grains of the dielectric grain,to deteriorate insulation resistance characteristic.

e) Fourth Accessory Component

According to an embodiment of the present disclosure, the dielectricceramic composition may further contain Mn, Ni, W, V, or Fe, or mixturesthereof, as a fourth accessory component.

The dielectric ceramic composition may contain Mn, Ni, W, V, or Fe, ormixtures thereof, as the fourth accessory component in an amount of 0.2moles or more and 0.7 moles or less, based on 100 moles of Ti.

The fourth accessory component may serve to improve a firing temperaturedrop and a high-temperature withstand voltage characteristics of themulti-layered ceramic capacitor to which the dielectric ceramiccomposition is applied.

The dielectric ceramic composition may contain Mn, Ni, W, V, or Fe, ormixtures thereof, as the fourth accessory component in an amount of 0.2moles or more and 0.7 moles or less, based on 100 moles of Ti, toimprove the high-temperature withstand voltage characteristics of themulti-layered ceramic capacitor.

The firing temperature at which the content of the fourth accessorycomponent is less than 0.2 moles, based on 100 moles of Ti, mayincrease, and the high-temperature withstand voltage characteristics maysomewhat decrease.

When the content of the fourth accessory component is more than 0.7moles, based on 100 moles of Ti, the high-temperature withstand voltagecharacteristics and the room temperature resistivity may decrease.

f) Fifth Accessory Component

According to an embodiment of the present disclosure, the dielectricceramic composition may contain Si as a fifth accessory component.

The dielectric ceramic composition may contain Si as a fifth accessorycomponent in an amount of 1.2 moles or more and 2.2 moles or less, basedon 100 moles of Ti.

The fifth accessory component may serve to improve the firingtemperature drop and the high-temperature withstand voltagecharacteristics of the multi-layered ceramic capacitor to which thedielectric ceramic composition is applied.

When the content of the fifth accessory component is less than 1.2moles, based on 100 moles of Ti, the firing temperature may increase.

When the content of the fifth accessory component exceeds 2.2 moles,based on 100 moles of Ti, the high-temperature withstand voltagecharacteristics may decrease.

The content of the first to the fifth accessory components according toan embodiment of the present disclosure may be measured by inductivelycoupled plasma (ICP) analysis and electron probe microanalysis (EPMA).

When the content of the first to the fifth accessory components ismeasured by inductively coupled plasma (ICP) analysis, ICP mass analysisin which a plurality of ionized atoms generated in an ICP light sourceare introduced into a mass spectrometer for quantitative analysis, anICP spectrometric analysis in which a specimen is mixed in a dischargeplasma generated by flowing a high frequency current through a coil inflow of inert gas for spectroscopic analysis, or the like, may beapplied.

Meanwhile, EPMA, which is a nondestructive analysis method, may be amethod capable of having high spatial resolution and performingqualitative and quantitative analysis of micron-level fine elements,using X-rays generated when an electron beam accelerated at high speedcollides with a material.

Referring to FIG. 4, in a multi-layered ceramic electronic componentaccording to an embodiment of the present disclosure, a thickness (t1)of the dielectric layer 111 interposed between the first and secondinternal electrodes 121 and 122 and a thickness (t2) of the first andsecond internal electrodes 121 and 122 satisfy the relationship t1>2×t2.

For example, according to an embodiment of the present disclosure, thethickness (t1) of the dielectric layer 111 may be larger than twice thethickness (t2) of the internal electrodes 121 and 122.

Generally, electronic components in a high voltage electric/electronicdevice may have a reliability problem due to a decrease in dielectricbreakdown voltage under a relatively high voltage environment.

The multi-layered ceramic capacitor according to an embodiment of thepresent disclosure may improve dielectric breakdown voltagecharacteristics by increasing the thickness (t1) of the dielectric layer111 larger than twice the thickness (t2) of the internal electrodes 121and 122 to prevent a decrease in dielectric breakdown voltage under arelatively high voltage environment, and by increasing a thickness ofthe dielectric layer which is a distance between the internalelectrodes.

When the thickness (t1) of the dielectric layer 111 is twice or lessthan the thickness (t2) of the internal electrodes 121 and 122, thedielectric breakdown voltage may decrease due to a relatively thindielectric layer, which is a distance between the internal electrodes.

The thickness (t2) of the internal electrode may be less than 1.0 μm,and the thickness (t1) of the dielectric layer may be less than 2.8 μm,but is not necessarily limited thereto.

FIG. 5 is a cross-sectional view taken along line I-I′ in FIG. 1according to another embodiment of the present disclosure.

Referring to FIG. 5, a multi-layered ceramic capacitor according toanother embodiment of the present disclosure may further include aplurality of floating electrodes 123 which are staggered with first andsecond internal electrodes 121′ and 122′ in a ceramic body 110 in athickness direction, and both end portions thereof overlap a portion ofthe first and second internal electrodes 121′ and 122′, respectively.

The first and second internal electrodes 121′ and 122′ may be electrodeshaving different polarities, may be formed to be spaced apart from eachother on at least one surface of a ceramic sheet forming a dielectriclayer 111, and may be arranged to be exposed through both ends of theceramic body 110 in the ceramic body 110.

The first and second internal electrodes 121′ and 122′ exposed throughboth ends of the ceramic body 110 may be electrically connected to firstand second external electrodes 131 and 132, respectively.

The plurality of floating electrodes 123 may be staggered alternatelywith the first and second internal electrodes 121′ and 122′ in theceramic body 110 in the thickness direction of the ceramic body 110, anda portion of both end portions of them may partially overlap a portionof mutually spaced apart end portions of the first and second internalelectrodes 121′ and 122′, respectively.

The plurality of floating electrodes 123 may be spaced apart from bothends of the ceramic body 110 by 5% or more of the total length of theceramic body 110.

Meanwhile, according to another embodiment of the present disclosure,first and second dummy electrodes 124 a and 124 b may be arranged to bespaced apart from each other in an upper cover portion C1 and a lowercover portion C2 arranged respectively above and below an active portionA.

The first dummy electrode 124 a may be exposed on the same plane as anouter surface of the ceramic body 110 on which the first inner electrode121′ is exposed, and the second dummy electrode 124 b may be exposed onthe same plane as an outer surface of the ceramic body 110 on which thesecond inner electrode 122′ is exposed.

The bending strength of the multi-layered ceramic capacitor may beimproved by exposing the first dummy electrode 124 a on the same planeas an outer surface of the ceramic body 110 on which the first innerelectrode 121′ is exposed, and by exposing the second dummy electrode124 b on the same plane as an outer surface of the ceramic body 110 onwhich the second inner electrode 122′ is exposed.

Hereinafter, a method of manufacturing a multi-layered ceramicelectronic component according to an embodiment of the presentdisclosure will be described, but the present disclosure is not limitedthereto.

In a method of manufacturing a multi-layered ceramic electroniccomponent according to an embodiment of the present disclosure, a slurryincluding a dielectric ceramic composition containing: a base materialrepresented by (Ba_(1-x)Ca_(x))TiO₃ (0<x≤0.09) as a main component; Y asa first accessory component; Mg as a second accessory component; Ba orZr, or a mixture thereof, as a third accessory component; Mn, Ni, W, V,or Fe, or mixtures thereof, as a fourth accessory component; and Si as afifth accessory component; may be applied on a carrier film, and maythen be dried to form a plurality of ceramic green sheets, to form adielectric layer.

The ceramic green sheet may be prepared by mixing a ceramic powder, abinder, and a solvent to prepare a slurry, and by subjecting the slurryto a doctor blade method to form a sheet having a thickness of severalmicrometers.

Next, an internal electrode conductive paste having an average nickelparticle size of 0.1 to 0.2 μm and containing nickel powder of 40 to 50parts by weight may be provided.

The internal electrode conductive paste may be applied on the greensheet by a screen printing method to form internal electrodes, and thengreen sheets on which internal electrode patterns are arranged may bestacked to forma ceramic body 110.

Next, an electrode layer including one or more conductive metal selectedfrom the group consisting of copper (Cu), silver (Ag), nickel (Ni), andalloys thereof, and glass may be formed outside of the ceramic body.

The glass is not particularly limited, and a material having the samecomposition as glass used for manufacturing an external electrode of aconventional multi-layered ceramic capacitor may be used.

The electrode layer may be formed on the upper and lower surfaces andthe end portions of the ceramic body to be electrically connected to thefirst and second internal electrodes, respectively.

The electrode layer may contain 5% by volume or more of glass, based onthe conductive metal.

Next, a conductive resin composition may be applied on the electrodelayers 131 a and 132 a, and then cured, to form the conductive resinlayers 131 b and 132 b.

The conductive resin layers 131 b and 132 b may include one or moreconductive metal selected from the group consisting of copper (Cu),silver (Ag), nickel (Ni), and alloys thereof, and a base resin, and thebase resin may be an epoxy resin.

Next, nickel (Ni) plated layers 131 c and 132 c may be formed on theconductive resin layers 131 b and 132 b, and tin (Sn) plated layers 131d and 132 d may be formed on the nickel (Ni) plated layers 131 c and 132c. The tin (Sn) may be replaced with palladium (Pd).

Examples according to an embodiment of the present disclosure, andcomparative examples prepared for comparison of characteristics weremanufactured by the following method, and electrical characteristics ofeach case were compared. All of the molar amounts described in theExamples are based on 100 moles of Ti.

First, Ca in a base material as a main component was contained in anamount of 8 moles, based on 100 moles of Ti, Zr as a third accessorycomponent was contained in an amount of 2.0 moles, Mn in the transitionmetal as a fourth accessory component was contained in an amount of 0.55moles, Si as a fourth accessory component and a firing aid was containedin an amount of 2.0 moles, to prepare a dielectric ceramic mixture.

3.0 moles, 4.0 moles, 5.0 moles, and 6.0 moles of Y as a first accessorycomponent in an oxide form were respectively added to the preparedceramic mixture to prepare each ceramic mixture sample, 1.5 moles, 2.0moles, 2.5 moles, and 3.0 moles of Mg as a second accessory componentwere respectively added to the prepared ceramic mixture to prepare eachceramic mixture sample, and a multi-layered ceramic capacitor wasfabricated using each of the samples.

It is necessary to secure a mean time to failure (MTTF) of 20 hours ormore under a relatively high temperature acceleration condition of 180°C. and 20 V/μm, to guarantee a relatively long service life in anenvironment of 150° C. or higher.

The MTTF refers to an average time period until failure of an electroniccomponent, which means an average failure time period corresponding to atime period until a non-repairable case, for example, a time period tooccurrence of failure of an electronic component.

The dielectric constant characteristic according to temperature shouldhave a dielectric constant within the range of ±15° C., based on thedielectric constant at 25° C. in the range of −55° C. to 150° C. Thegrain size of the dielectric grains is preferably 200 nm to 400 nm, andmore preferably 200 nm or less.

When Mg as a second accessory component in the form of oxide is in anamount of 1.5 moles, the grain size of the dielectric grains afterfiring of all the compositions may be 400 nm or more, not to satisfydesired characteristics of a product therefrom.

When Mg as a second accessory component in the form of oxide is in anamount of 3.0 moles, MTTF was measured to be within 5 hours of MTTF inall cases of which Y oxide as a rare earth metal is in an amount of 3.0to 6.0 moles, not to satisfy desired reliability of a product therefrom.

When Mg as a second accessory component in the form of oxide is in anamount of 2.0 moles, MTTF according to respective content of Y oxide asa rare earth metal was measured to be 35.6 hours at 4.0 moles and 27.1hours at 5.0 moles, respectively, to satisfy desired reliability of aproduct therefrom.

When Mg in the form of oxide is in an amount of 2.0 moles as describedabove, MTTF according to respective content of Y oxide as a rare earthmetal was measured to be 15.3 hours at 3.0 moles and 5.8 hours at 6.0moles, respectively, not to satisfy desired reliability of a producttherefrom.

Meanwhile, when Mg as a second accessory component in the form of oxideis in an amount of 2.5 moles, MTTF according to respective content of Yoxide as a rare earth metal was measured to be 30.6 hours at 4.0 molesand 24.1 hours at 5.0 moles, respectively, to satisfy desiredreliability of a product therefrom.

When Mg in the form of oxide is in an amount of 2.5 moles as describedabove, MTTF according to respective content of Y oxide as a rare earthmetal was measured to be 12.7 hours at 3.0 moles and 9.5 hours at 6.0moles, respectively, not to satisfy desired reliability of a producttherefrom.

According to an embodiment of the present disclosure, a high-capacitymulti-layered ceramic capacitor stably securing the rate of change inhigh-temperature capacity may be realized, by way of controlling thecontent of each component in the dielectric layer containing a basematerial represented by (Ba_(1-x)Ca_(x))TiO₃ (0<x≤0.09) as a maincomponent, Y as a first accessory component, Mg as a second accessorycomponent, Ba or Zr, or a mixture thereof, as a third accessorycomponent, Mn, Ni, W, V, or Fe, or mixtures thereof, as a fourthaccessory component, and Si as a fifth accessory component.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentdisclosure as defined by the appended claims.

What is claimed is:
 1. A multi-layered ceramic electronic componentcomprising: a ceramic body including a dielectric layer, and a pluralityof first and second internal electrodes opposing each other with thedielectric layer interposed therebetween, and including first and secondsurfaces opposing each other in a first direction, third and fourthsurfaces connected to the first and second surfaces and opposing eachother in a second direction, and fifth and sixth surfaces connected tothe first to fourth surfaces and opposing each other in a thirddirection; and first and second external electrodes arranged outside ofthe ceramic body and electrically connected to the first and secondinternal electrodes, wherein the dielectric layer comprises a dielectricceramic composition containing: a base material represented by(Ba_(1-x)Ca_(x))TiO₃ (0<x≤0.09) as a main component, a first accessorycomponent of yttrium (Y), a second accessory component of magnesium(Mg), a third accessory component of barium (Ba) or zirconium (Zr), or amixture thereof, a fourth accessory component of manganese (Mn), nickel(Ni), tungsten (W), vanadium (V), or iron (Fe), or mixtures thereof, afifth accessory component of silicon (Si), and wherein the dielectricceramic composition comprises Si in an amount 1.2 moles or more and 2.2moles or less, based on 100 moles of Ti.
 2. The multi-layered ceramicelectronic component according to claim 1, wherein the dielectricceramic composition comprises Y in an amount more than 3 moles and lessthan 6 moles, based on 100 moles of Ti, in the form of oxide.
 3. Themulti-layered ceramic electronic component according to claim 1, whereinthe dielectric ceramic composition comprises Mg in an amount 1.5 molesor more and 2.5 moles or less, based on 100 moles of Ti, in the form ofoxide.
 4. The multi-layered ceramic electronic component according toclaim 1, wherein at total amount of Ba and Zr included in the dielectricceramic composition is 1.5 moles or more and 3.5 moles or less, based on100 moles of Ti.
 5. The multi-layered ceramic electronic componentaccording to claim 1, wherein a total amount of Mn, Ni, W, V, and Feincluded in the dielectric ceramic composition is 0.2 moles or more and0.7 moles or less, based on 100 moles of Ti.
 6. The multi-layeredceramic electronic component according to claim 1, wherein the basematerial further comprises BaTiO₃, BaTi₂O₅, or (Ba_(1-x)Ca_(x))Ti₂O₅, ormixtures thereof (0<x≤0.09).
 7. The multi-layered ceramic electroniccomponent according to claim 6, wherein a total amount of BaTi₂O₅ and(Ba_(1-x)Ca_(x))Ti₂O₅ included in the dielectric ceramic composition is30 mol % or less, based on 100 mol % of the base material.
 8. Themulti-layered ceramic electronic component according to claim 1, whereindielectric grains contained in the dielectric layer have an average sizeof 200 nm or less.
 9. The multi-layered ceramic electronic componentaccording to claim 1, wherein a thickness (t1) of the dielectric layerinterposed between the first and second internal electrodes is less than2.8 μm.
 10. The multi-layered ceramic electronic component according toclaim 1, wherein a thickness (t2) of the first and second internalelectrodes is less than 1.0 μm, respectively.
 11. The multi-layeredceramic electronic component according to claim 1, wherein a thickness(t1) of the dielectric layer and a thickness (t2) of the first andsecond internal electrodes satisfy the relationship t1>2×t2.
 12. Themulti-layered ceramic electronic component according to claim 1, furthercomprising a plurality of floating electrodes which are staggered withthe first and second internal electrodes in the ceramic body in athickness direction, and both end portions thereof overlap a portion ofthe first and second internal electrodes, respectively.
 13. Themulti-layered ceramic electronic component according to claim 1, whereinthe ceramic body comprises: an active portion including a plurality ofinternal electrodes opposing each other with the dielectric layerinterposed therebetween; cover portions formed above and below theactive portion; and first and second dummy electrodes which are arrangedto be spaced apart from each other in the cover portions.
 14. Themulti-layered ceramic electronic component according to claim 13,wherein the first dummy electrode is exposed on the same surface as asurface of the ceramic body on which the first internal electrode isexposed, and the second dummy electrode is exposed on the same surfaceas a surface of the ceramic body on which the second internal electrodeis exposed.